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生产能力
我们在香港的研发及NPI中心使Gentech在业内保持竞争力。 凭借在中国制造工厂的能力，Gentech具有“先进技术，可靠质量，高效生产”的竞争优势。
高标准品质 | 客制化服务 | 组装创新
R&D and NPI Centre
Shatin, Hong Kong
Assembly Plant
Dongguan, China
PCB Scope
Rigid, Flexible, Flex-Rigid, HDI,
Aluminum, and Semi-Flex PCBs
Maximum PCB Size
Standard: 330mm x 250mm
Advanced: 410mm x 360mm
Component Size
From 1005 to 24mm x 72mm
Wire Bonding
Fine Pitch 55um x 65um
High Speed Wire Bonding
6.5 wires/second
BGA, Micro-BGA, FGBA
Flip Chip and CSP
Minimum Ball Pitch 0.2mm
Ball Dimension 0.1mm
Depanelization
Routing Machine
Scoring Machine
Fine Pitch IC
Minimum 0.2mm pitch
IC Programming
(Online/Offline)
Manufacturing
Specification
IPC 610 Class 2&3
Surface Mount Capacity:
78 Million chips/month
Lead Free Soldering
Surface Mount Reflow, Wave Soldering
Selective Soldering, Robotic Soldering
Testing Capability
AOI, ICT, X-Ray, SPI, Burn-In Test
Customized Functional Test
7 Surface Mount
Technology Lines
Box Assembly
Cable
Harness
Assembly
Conformal Coating
and Nano Coating
BGA
Rework
Station
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